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| The patented µPOST technology is demonstrable as the cheapest and most flexible method for reliably connecting bare die to any substrate material! |
 We can attach µPOSTdirectly onto wafer or singular bare die. |
| Fully test and Burn-in if required |
| Then subsequently attach the individual die directly onto any substrate. |
| By doing away with packages, µPOST systems are ... |
| Smaller |
| The pad to bond out is direct removing pad limiting restrictions of an additional package |
| Faster |
| The electrical distance from the pad to the circuit board is reduced with less boundaries |
| More reliable |
| µPOST’s flex under strain providing a greater reliability, also the pull test is included in the process |
| Environmentally sensitive |
| The die is directly attached through posts to the system board removing the need for additional packaging |
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| .... and provide a far more cost effective solution |
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Here are some examples: 400 connections on a die with a 2.5xx x 2.5mm and 100µm spacing Fully tested die at wafer-level, pre sawing Outperforming BGA through accommodating shear stress through thermal expansion Using a standard thermo-sonic bonding tool to attach the µPOST pins
Further details on the technology can be found here: |
CHIP-SIZE POST ARRAYS
