Experts in fast turn & prototype assembly

Incorporating Semi-Dice Power : for crystals, oscillators and hard to find components

There’s more than one way to package your IC
(but only one best way)

There are literally thousands of registered package outlines and probably just as many commercially available assembly techniques.
Our resident packaging consultant Elwyn Wakefield will help you select the best combination for your product.

Hermetic, Plastic or Chip-onBoard

We can assemble to suit any footprint.
Batch sizes from 1 to 10k
Choice of UK or US assembly
Chip-on-Board ( including Flip-chip ).
In days rather than weeks

Enabling access to revolutionary package-less test and SMT assembly

Utilising µPOST technology will:-

Save wafer real-estate

Save on any NRE engaged in device development

Save on device and system assembly costs

Save by simplifying and time reduction on prototype and bring up for new devices and much more …